Mechanical Activation of Chemical Process

Damascene Process and Chemical Mechanical Planarization )e

The constant demand to scale down transistors and improve device performance has led to material as well as process changes in the formation of IC interconnect. Traditionally, aluminum has been used to form the IC interconnects. The process involved subtractive etching of blanket aluminum as defined by the patterned photo resist. However, the scaling and performance demands have led to transiti...

Damascene Process and Chemical Mechanical Planarization

Device independent process control of dielectric chemical mechanical polishing

The use of the chemical-mechanical polishing (CMP) process in the semiconductor industry is growing rapidly, and it is a critical step in the manufacturing of integrated circuits. The CMP process is complicated by many factors, and controlling all of these factors in a single controller has been unrealistic. One of the most significant factors complicating control is the dependency of the polis...

Advanced Process Control in Dielectric Chemical Mechanical Polishing (cmp)

The decrease in device dimensions is placing extremely tight constraints on many aspects of the CMP process. We outline four key areas that will provide significant steps toward attaining this level of control. In particular, we discuss the need for improved in-line surface topography metrology, and show that that high resolution profilometry appears to meet this need. We demonstrate the need f...

Studying ilmenite dissolution using mechanical activation method

In this work, the effects of temperature, acid concentration, and mechanical activation on dissolution of ilmenite were studied using the statistical design of experiment technique. Mechanical activation was carried out using a planetary ball mill in dry mode, and the resulting structural changes were characterized by the particle size analysis, specific surface area measurements, and X-ray dif...